Camera modules can be classified into various types based on different classification criteria such as usage, structure, technology, etc. The following are common classifications and types:
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### **1. Classified by Sensor Technology**
-CCD (Charge Coupled Device) module**
-High image quality and low noise, but high power consumption and cost, mainly used in professional fields such as industrial inspection and high-end photography.
-* * CMOS (Complementary Metal Oxide Semiconductor) module**
-Mainstream technology with low power consumption, high integration, and low cost, widely used in fields such as mobile phones, security, and consumer electronics.
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### **2. Classify by focusing method**
-Fixed Focus (FF) module**
-Fixed focal length, simple structure, low cost, commonly used in low-end devices or scenes with low focusing requirements (such as access control cameras).
-Auto Focus (AF) module**
-Support dynamic focusing, common techniques:
-VCM (Voice Coil Motor) driver: The mainstream solution for mobile phone cameras.
-Piezo (piezoelectric motor): More precise, used for high-end equipment.
-Liquid lens: By adjusting the focal length through voltage, the response speed is fast.
-Zoom module**
-* * Optical zoom * *: Non destructive zoom is achieved by moving the lens group (such as telephoto cameras).
-* * Digital zoom * *: By using algorithms to crop and enlarge the image, the picture quality may decrease.
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### **3. Classified by the number of lenses**
-* * Single camera module**
-A single camera with a single function, commonly found on low-end devices.
-Multi camera module**
-Combination of dual camera, triple camera, quad camera, etc., with different division of labor for each lens (such as main camera+ultra wide angle+telephoto+depth of field), to enhance the shooting effect (such as multi camera system on mobile phones).
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### **4. Classified by application scenario**
-Mobile phone camera module**
-Miniaturization, high pixel count, and support for technologies such as AF/OIS (optical image stabilization).
-* * Security monitoring module**
-Emphasize low light performance, wide dynamic range (WDR), infrared night vision, etc.
-Car camera module**
-High reliability and high temperature resistance, used for ADAS (such as surround view and front view cameras).
-Industrial camera module**
-High resolution, high-speed shooting, used for machine vision, inspection, etc.
-Medical Endoscope Module**
-Miniature and sterile design, supporting high-definition imaging.
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### **5. Classified by special functions**
-* * 3D sensing module**
-* * Structured light * * (such as iPhone Face ID), * * ToF (time-of-flight) * *, * * binocular stereo vision * *, used for depth perception.
-* * Panoramic camera module**
-Ultra wide angle or fisheye lens, achieving 360 ° shooting.
-Infrared (IR) camera module**
-Support night vision or thermal imaging for security or military purposes.
-Anti shake module (OIS/EIS)**
-OIS (Optical Image Stabilization) compensates for shake by physically moving the lens or sensor.
-EIS (Electronic Image Stabilization): Implemented through algorithmic cropping of images.
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### **6. Classified by packaging form**
-CSP (Chip Scale Package) module**
-Compact packaging, low cost, commonly used in consumer electronics.
-COB (Chip on Board) module**
-The sensor is directly bound to the PCB, which has a complex process but high reliability.
-* * FC (Flip Chip) module**
-Inverted chip technology enhances integration and performance.
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### **7. Other special types**
-* * USB camera module**
-Plug and play, used for computers, video conferences, etc.
-AI camera module**
-Built in AI chip, supporting intelligent functions such as facial recognition and behavior analysis.
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###* * Summary**
The choice of camera module depends on application requirements, such as:
-Mobile phone: Multi camera CMOS module (main camera+ultra wide angle+telephoto)+AF/OIS.
-Vehicle mounted: High dynamic range CMOS module, resistant to extreme environments.
-* * Industrial * *: High speed, high-resolution CCD/CMOS modules.
With the development of technology, modules are evolving towards multi camera fusion, 3D perception, AI intelligence, and other directions.
